Form：Topology 2017/8/17Browse：5688

According to the latest statistics of Tuo Industrial Research Institute, the world's top ten IC design industry in the second quarter of 2017 revenue and ranking baked, in addition to MediaTek (MediaTek) and Marvell (Marvell) revenue decline, the remaining eight industry are presented Growth trend, Broadcom, Qualcomm and NVIDIA ranked third in revenue.

Form：Microchip 2017/8/16Browse：5091

Microchip Technology Inc. today announced MPLAB ICD 4 - Microchip's online programming and debugging development tools for the PIC microcontroller and dsPIC digital signal controller family.

Form：Nordic 2017/8/16Browse：4599

The solution includes a support for 20 links, multi-role, Bluetooth 5 certified S132 v5.0 protocol stack, in all role combinations to provide full-link concurrent.

Form：Bosch 2017/8/15Browse：4818

Bosch Sensortec Announces New MEMS Acceleration Sensors for Wearable Devices to Deliver High Performance and Easy Integration in Compact Packaging The BMA456 is designed for sporting and fitness tracking of wearable devices.

Form：Global Foundries 2017/8/15Browse：4662

Today announced the 2.5D package solution, demonstrating its capabilities for the high-performance 14nm FinFET FX-14ASIC integrated circuit design system.

Form：Qorvo 2017/8/11Browse：4260

Qorvo, Inc., a provider of innovative RF solutions for the interconnected world, today announced the availability of a new asymmetric Doherty amplifier, the QPD2731, to help customers achieve ultra-high efficiency in designing wireless base station equipment.

Form：Terence Semiconductor 2017/8/11Browse：4340

Trichet Semiconductor Co., Ltd. has developed a series of lithium-ion polymer secondary batteries (hereinafter referred to as lithium batteries) capable of charging the IC XC6808 series corresponding to the voltage of 4.35V and 4.40V after charging.

Form：Silicon Labs 2017/8/10Browse：5085

Silicon Labs (also known as "Core Technology") has launched the industry's most scalable, flexible and cost-effective car radio solution for the global automotive infotainment market.

Form：Linghua Technology 2017/8/10Browse：4423

ADLINK is committed to promoting cross-industry data decision-making applications, as the world's leading provider of edge computing solutions, today announced the new media cloud server MCS-2080, a dedicated high-density platform, in 2U space can support Up to 16 Intel Xeon E3-1585 v5 processors.

Form：Vishay 2017/8/8Browse：5418

Vishay Intertechnology, Inc. today announced the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications - the VitramonVJ HIFREQ HT series with operating temperature range of +200 ° C